Patent Assignment
Reel/Frame 039498/0266
Assignment of Assignor's Interest
Recorded: 2016-08-22
Pages: 4
Assignors
HSU, FENG-CHENG
Executed: 2016-08-02
CHEN, SHUO-MAO
Executed: 2016-08-02
HUNG, JUI-PIN
Executed: 2016-08-09
JENG, SHIN-PUU
Executed: 2016-08-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Package Structure