Patent Assignment
Reel/Frame 039513/0621
Assignment of Assignor's Interest
Recorded: 2016-08-23
Pages: 2
Assignors
JENG, SHIN-PUU
Executed: 2016-08-15
LIU, HSIEN-WEN
Executed: 2016-08-09
LIN, YI-JOU
Executed: 2016-08-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Using Metal-Containing Layer to Reduce Carrier Shock in Package Formation