Patent Assignment
Reel/Frame 039567/0864
Assignment of Assignor's Interest
Recorded: 2016-08-29
Pages: 5
Assignors
KIM, KI-IL
Executed: 2016-05-04
YOU, JUNG-GUN
Executed: 2016-05-04
PARK, GI-GWAN
Executed: 2016-05-12
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Device and Method of Manufacturing the Same