Patent Assignment
Reel/Frame 039570/0234
Assignment of Assignor's Interest
Recorded: 2016-08-30
Pages: 5
Assignors
LO, WAN-YU
Executed: 2016-08-16
LIU, CHIN-CHOU
Executed: 2016-08-18
YANG, KUO-NAN
Executed: 2016-08-16
CHANG, YU-JEN
Executed: 2016-08-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Integrated Fan-Out Package and Layout Method Thereof