Patent Assignment
Reel/Frame 039590/0469
Assignment of Assignor's Interest
Recorded: 2016-08-30
Pages: 4
Assignors
NELSON, DONALD W.
Executed: 2014-06-16
WEBB, M CLAIR
Executed: 2014-08-05
MORROW, PATRICK
Executed: 2014-06-16
JUN, KIMIN
Executed: 2014-06-16
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Method for Direct Integration of Memory Die to Logic Die Without Use of Thru Silicon Vias (Tsv)