Patent Assignment
Reel/Frame 039598/0841
Assignment of Assignor's Interest
Recorded: 2016-08-31
Pages: 6
Assignors
LEE, DONG-SIK
Executed: 2016-05-31
KIM, YOUNGWOO
Executed: 2016-06-20
SHIN, JINHYUN
Executed: 2016-06-20
LEE, JUNG HOON
Executed: 2016-05-31
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Three-Dimensionally Integrated Circuit Devices Including Oxidation Suppression Layers