Patent Assignment
Reel/Frame 039616/0420
Assignment of Assignor's Interest
Recorded: 2016-09-01
Pages: 2
Assignors
CHIU, MING-YEN
Executed: 2016-08-12
HUANG, HSIN-CHIEH
Executed: 2016-08-15
CHANG, CHING FU
Executed: 2016-08-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Package with Tilted Interface between Device Die and Encapsulating Material