Patent Assignment
Reel/Frame 039620/0579
Assignment of Assignor's Interest
Recorded: 2016-09-02
Pages: 4
Assignors
CHEN, YING-JU
Executed: 2016-08-09
SU, AN-JHIH
Executed: 2016-08-09
CHEN, HSIEN-WEI
Executed: 2016-08-09
YEH, DER-CHYANG
Executed: 2016-08-09
WU, CHI-HSI
Executed: 2016-08-15
YU, CHEN-HUA
Executed: 2016-08-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Structure and Method of Forming a Joint Assembly