Patent Assignment
Reel/Frame 039621/0232
Assignment of Assignor's Interest
Recorded: 2016-09-02
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Method of Manufacturing Interconnect Layer and Semiconductor Device Which Includes Interconnect Layer