Patent Assignment
Reel/Frame 039627/0034
Assignment of Assignor's Interest
Recorded: 2016-09-04
Pages: 13
Assignors
SUTHIWONGSUNTHORN, NATHAPONG
Executed: 2016-02-10
DIMAANO, ANTONIO JR. BAMBALAN
Executed: 2016-02-03
HUANG, RUI
Executed: 2016-02-10
TAN, HUA HONG
Executed: 2016-02-10
LE, KRIANGSAK SAE
Executed: 2016-05-26
HO, BENG YEUNG
Executed: 2015-08-11
ROBLES, ROEL ADEVA
Executed: 2016-02-10
MICLA, WEDANNI LINSANGAN
Executed: 2015-08-11
Assignee
UTAC HEADQUARTERS PTE. LTD.
22 ANG MO KIO INDUSTRIAL PARK 2, SINGAPORE, 569506, SINGAPORE
Covered Property
(1)
Semiconductor Packages and Methods of Packaging Semiconductor Devices