Patent Assignment
Reel/Frame 039661/0870
Assignment of Assignor's Interest
Recorded: 2016-09-07
Pages: 3
Assignee
MITSUBISHI HEAVY INDUSTRIES, LTD.
16-5, KONAN 2-CHOME, MINATO-KU, TOKYO, 1088215, JAPAN
Covered Property
(1)
Multichip Module Including Surface Mounting Part Embedded Therein