Patent Assignment
Reel/Frame 039679/0316
Assignment of Assignor's Interest
Recorded: 2016-09-08
Pages: 3
Assignors
CHEN, HSIN-HUNG
Executed: 2016-08-30
KAO, MIN-FENG
Executed: 2016-08-30
LIN, HSING-CHIH
Executed: 2016-08-30
LIU, JEN-CHENG
Executed: 2016-08-30
YAUNG, DUN-NIAN
Executed: 2016-08-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Through via Structure, Semiconductor Device and Manufacturing Method Thereof