Patent Assignment
Reel/Frame 039682/0637
Assignment of Assignor's Interest
Recorded: 2016-09-09
Pages: 6
Assignors
LOH, YANG-GYOON
Executed: 2016-05-24
RYU, JE-MIN
Executed: 2016-05-24
KIM, HYUN-KI
Executed: 2016-05-24
JEONG, YOON-JAE
Executed: 2016-05-24
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Having Chip Id Generation Circuit