IP Library › Assignment 039715/0430
Patent Assignment
Reel/Frame 039715/0430

Assignment of Assignor's Interest

Recorded: 2016-08-17 Pages: 3
Assignors
EDELSTEIN, DANIEL C
Executed: 2016-08-16
YANG, CHIH-CHAO
Executed: 2016-08-17
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Formation of Advanced Interconnects Including Set of Metal Conductor Structures in Patterned Dielectric Layer
Application: 15/239,198 →
Publication: US 2018/0053725