IP Library › Assignment 039753/0802
Patent Assignment
Reel/Frame 039753/0802

Assignment of Assignor's Interest

Recorded: 2016-09-15 Pages: 2
Assignor
WATANABE, TOSHIHIKO
Executed: 2016-08-03
Assignee
SONY CORPORATION
1-7-1 KONAN, MINATO-KU, TOKYO, 108-0075, JAPAN
Covered Property (1)
Mounting Substrate, Manufacturing Method for the Same, and Component Mounting Method
Patent: 9,814,139 →
Application: 15/124,499 →
Publication: US 2017/0019996
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 11, 2017
From: SONY CORPORATION
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 043546/0060 →