IP Library › Assignment 039754/0952
Patent Assignment
Reel/Frame 039754/0952

Assignment of Assignor's Interest

Recorded: 2016-09-15 Pages: 5
Assignor
Assignee
APPLIED MATERIALS, INC.
3050 BOWERS AVENUE, SANTA CLARA, CALIFORNIA, 95054
Covered Properties (7)
Process Kit Having Tall Deposition Ring and Deposition Ring Clamp
Patent: 9,909,206 →
Application: 15/201,019 →
Publication: US 2017/0002461
Methods of Enhancing Polymer Adhesion to Copper
Patent: 9,922,874 →
Application: 15/200,836 →
Publication: US 2018/0005881
Methods and Apparatus for a Microwave Batch Curing Process
Application: 15/165,377 →
Publication: US 2016/0353522
Methods and Apparatus for Correcting Substrate Deformity
Patent: 9,818,624 →
Application: 15/142,220 →
Publication: US 2016/0322234
Methods for Polyimide Coefficient of Thermal Expansion (Cte) Tuning by Microwave Curing
Application: 62/352,005 →
Methods and Apparatus for Transferring a Substrate
Application: 14/933,628 →
Publication: US 2016/0133490
Substrate Transfer Chamber
Application: 14/933,635 →
Publication: US 2016/0133494
Related Assignments (13)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 29, 2016
From: THIRUNAVUKARASU, SRISKANTHARAJAH; PEH, ENG SHENG; SUNDARRAJAN, ARVIND
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 037853/0559 →
Assignment of Assignor's Interest Feb 29, 2016
From: NEMANI, SRINIVAS D.; YIEH, ELLIE Y.; AVULA, AVINASH
To: APPLIED MATERIALS, INC.
Reel/Frame 037853/0643 →
Assignment of Assignor's Interest Mar 3, 2016
From: NEMANI, SRINIVAS D.; AVULA, AVINASH; YIEH, ELLIE Y.
To: APPLIED MATERIALS, INC.
Reel/Frame 037884/0607 →
Assignment of Assignor's Interest Mar 3, 2016
From: THIRUNAVUKARASU, SRISKANTHARAJAH; PEH, ENG SHENG; SUNDARRAJAN, ARVIND
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 037884/0762 →
Assignment of Assignor's Interest Jun 2, 2016
From: RATHI, SAKET; SUNDARARAJAN, MUKUND; VENKATASWAMAPPA, MAJUNATH HANDENAHALLI
To: APPLIED MATERIALS, INC.
Reel/Frame 038772/0638 →
Assignment of Assignor's Interest Jun 2, 2016
From: JUPUDI, ANANTHKRISHNA
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 038772/0711 →
Assignment of Assignor's Interest Jul 7, 2016
From: OW, YUEH SHENG; WANG, RUI; KOH, TUCK FOONG; WANG, XIN
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 039101/0209 →
Assignment of Assignor's Interest Jul 18, 2016
From: ELUMALAI, KARTHIK
To: APPLIED MATERIALS, INC.
Reel/Frame 039179/0528 →
Assignment of Assignor's Interest Jul 18, 2016
From: LEW, JEN SERN; KOH, TUCK FOONG; THIRUNAVUKARASU, SRISKANTHARAJAH; PEH, ENG SHENG
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 039179/0665 →
Assignment of Assignor's Interest Jul 28, 2016
From: LEE, SAM; SHARBONO, CHARLES; BERNT, MARVIN LOUIS
To: APPLIED MATERIALS, INC.
Reel/Frame 039280/0986 →
Assignment of Assignor's Interest Jul 28, 2016
From: LIANTO, PRAYUDI; SEE, GUAN HUEI; SUNDARRAJAN, ARVIND
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 039281/0343 →
Assignment of Assignor's Interest Sep 1, 2016
From: JOHANSON, WILLIAM; SAVANDAIAH, KIRANKUMAR; ALLEN, ADOLPH MILLER; PRABHU, PRASHANT
To: APPLIED MATERIALS, INC.
Reel/Frame 039612/0932 →
Assignment of Assignor's Interest Sep 1, 2016
From: WANG, XIN
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 039613/0197 →