Patent Assignment
Reel/Frame 039775/0946
Assignment of Assignor's Interest
Recorded: 2016-09-19
Pages: 2
Assignor
SOYAMA, HIROSHI
Executed: 2016-09-05
Assignee
MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD.
32-12 KOROEN, SETTSU CITY, OSAKA 566-0034, JAPAN
Covered Property
(1)
Method for Dividing Brittle-Material Substrate