Patent Assignment
Reel/Frame 039778/0507
Assignment of Assignor's Interest
Recorded: 2016-09-19
Pages: 4
Assignor
KIM, SOONBUM
Executed: 2016-06-08
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package, Method of Fabricating the Same, and Semiconductor Module