Patent Assignment
Reel/Frame 039785/0357
Assignment of Assignor's Interest
Recorded: 2016-09-20
Pages: 3
Assignor
LIN, MING-TSE
Executed: 2015-11-17
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Wafer to Wafer Structure and Method of Fabricating the Same