Patent Assignment
Reel/Frame 039785/0461
Assignment of Assignor's Interest
Recorded: 2016-09-20
Pages: 6
Assignors
CHANG, CHIH-HAO
Executed: 2016-09-12
LIAO, HSIN-HUNG
Executed: 2016-09-12
TSAI, HAO-YI
Executed: 2016-09-12
HWANG, CHIEN-LING
Executed: 2016-09-12
CHANG, WEI-SEN
Executed: 2016-09-08
CHIANG, TSUNG-HSIEN
Executed: 2016-09-12
KUO, TIN-HAO
Executed: 2016-09-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Integrated Fan-Out Package and Method of Fabricating the Same