Patent Assignment
Reel/Frame 039802/0076
Assignment of Assignor's Interest
Recorded: 2016-09-20
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure with Dummy Die