Patent Assignment
Reel/Frame 039808/0805
Assignment of Assignor's Interest
Recorded: 2016-08-24
Pages: 2
Assignors
KIM, DONG SUN
Executed: 2016-08-09
RYU, SUNG WUK
Executed: 2016-08-09
LEE, JI HAENG
Executed: 2016-08-09
Assignee
LG INNOTEK CO., LTD.
SEOUL SQUARE, 416, HANGANG-DAERO, JUNG-GU, SEOUL, 04637, KOREA, REPUBLIC OF
Covered Property
(1)
Printed Circuit Board, Package Substrate Comprising Same, and Method for Manufacturing Same