Patent Assignment
Reel/Frame 039822/0442
Assignment of Assignor's Interest
Recorded: 2016-09-22
Pages: 6
Assignors
HUANG, LI-HSIEN
Executed: 2016-08-29
SU, AN-JHIH
Executed: 2016-08-29
CHEN, HSIEN-WEI
Executed: 2016-08-29
TSENG, HUA-WEI
Executed: 2016-08-29
WANG, JO-MEI
Executed: 2016-08-31
YANG, TIEN-CHUNG
Executed: 2016-08-30
LU, KUAN-CHUNG
Executed: 2016-08-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure and Manufacturing Method Thereof