Patent Assignment
Reel/Frame 039834/0663
Assignment of Assignor's Interest
Recorded: 2016-09-22
Pages: 4
Assignor
KWON, DOOWON
Executed: 2016-05-27
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Composite Wafer Semiconductor Devices Using Offset via Arrangements and Methods of Fabricating the Same