Patent Assignment
Reel/Frame 039836/0042
Assignment of Assignor's Interest
Recorded: 2016-09-22
Pages: 3
Assignors
BIRNER, ALBERT
Executed: 2016-09-12
BRECH, HELMUT
Executed: 2016-09-12
LAVANGA, SIMONE
Executed: 2016-09-21
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-12, NEUBIBERG, 85579, GERMANY
Covered Property
(1)
Method of Fabricating a Semiconductor Wafer That Includes Producing a Planarised Surface Having Both a Mesa Surface and an Insulating Layer Surface