Patent Assignment
Reel/Frame 039867/0805
Assignment of Assignor's Interest
Recorded: 2016-09-27
Pages: 6
Assignors
CHAE, KWANYEOB
Executed: 2016-06-30
JOO, SANGHOON
Executed: 2016-06-30
CHOI, JONG-RYUN
Executed: 2016-06-30
CHOI, JIN-HO
Executed: 2016-06-30
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chip Including a Plurality of Pads