Patent Assignment
Reel/Frame 039870/0870
Assignment of Assignor's Interest
Recorded: 2016-09-27
Pages: 4
Assignees
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
18 ZHANGJIANG ROAD, PUDONG NEW AREA, SHANGHAI, 201203, CHINA
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
NO. 18, WEN CHANG RD., ECONOMIC-TECHNOLOGICAL DEVELOPMENT AREA, DAXING DISTRICT, BEIJING, 100716, CHINA
Covered Property
(1)
Conductive Plug Structure and Fabrication Method Thereof