Patent Assignment
Reel/Frame 039874/0027
Assignment of Assignor's Interest
Recorded: 2016-09-28
Pages: 6
Assignors
OH, TAESEOK
Executed: 2016-08-03
LEE, JUNETAEG
Executed: 2016-08-03
SHIN, SEUNG-HUN
Executed: 2016-08-03
YOO, JAESANG
Executed: 2016-08-03
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Devices Having a Pad Structure