IP Library Assignment 039874/0037
Patent Assignment
Reel/Frame 039874/0037

Assignment of Assignor's Interest

Recorded: 2016-09-28 Pages: 3
Assignors
DUTARTRE, DIDIER
Executed: 2016-09-27
JAOUEN, HERVE
Executed: 2016-09-27
Assignee
STMICROELECTRONICS SA
29, BOULEVARD ROMAIN ROLLAND, MONTROUGE, F-92120, FRANCE
Covered Property (1)
Method for Manufacture of a Semiconductor Wafer Suitable for the Manufacture of an Soi Substrate, and Soi Substrate Wafer Thus Obtained
Patent: 9,929,039 →
Application: 15/129,328 →
Publication: US 2017/0103913
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Feb 23, 2024
From: STMICROELECTRONICS SA
To: STMICROELECTRONICS FRANCE
Reel/Frame 066663/0136 →