Patent Assignment
Reel/Frame 039925/0707
Assignment of Assignor's Interest
Recorded: 2016-10-03
Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2016-09-20
HUANG, LI-HSIEN
Executed: 2016-09-19
WU, CHI-HSI
Executed: 2016-09-26
YEH, DER-CHYANG
Executed: 2016-09-19
CHEN, HSIEN-WEI
Executed: 2016-09-19
SU, AN-JHIH
Executed: 2016-09-19
TSENG, HUA-WEI
Executed: 2016-09-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Package Structure and Method of Forming the Same