Patent Assignment
Reel/Frame 039959/0129
Assignment of Assignor's Interest
Recorded: 2016-10-06
Pages: 3
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Package Assembly for Thin Wafer Shipping and Method of Use
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.