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Patent Assignment
Reel/Frame 039959/0948

Assignment of Assignor's Interest

Recorded: 2016-10-06 Pages: 2
Assignor
XUE, YAN XUN
Executed: 2015-11-03
Assignee
ALPHA AND OMEGA SEMICONDUCTOR INCORPORATED
475 OAKMEAD PKWY, SUNNYVALE, CALIFORNIA, 94085
Covered Property (1)
Method and Structure for Wafer Level Packaging with Large Contact Area
Patent: 9,960,119 →
Application: 15/287,261 →
Publication: US 2017/0025356