Patent Assignment
Reel/Frame 039969/0983
Assignment of Assignor's Interest
Recorded: 2016-10-08
Pages: 3
Assignee
BRIDGE SEMICONDUCTOR CORPORATION
3FL., 157 LI-TE ROAD, PEITOU DIST., TAIPEI, 11259, TAIWAN
Covered Property
(1)
Thermally Enhanced Face-to-Face Semiconductor Assembly with Heat Spreader and Method of Making the Same
Application:
15/289,126 →
Publication:
US 2017/0025393