Patent Assignment
Reel/Frame 039981/0902
Assignment of Assignor's Interest
Recorded: 2016-10-11
Pages: 3
Assignors
TSAI, PEI-CHUN
Executed: 2016-09-21
CHANG, WEI-SEN
Executed: 2016-09-30
KUO, TIN-HAO
Executed: 2016-09-21
TSAI, HAO-YI
Executed: 2016-09-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method for forming semiconductor structure