Patent Assignment
Reel/Frame 040002/0214
Assignment of Assignor's Interest
Recorded: 2016-10-13
Pages: 3
Assignor
SEKINE, NAOKI
Executed: 2016-09-02
Assignee
SHINKAWA LTD.
51-1 INADAIRA 2-CHOME,, MUSASHIMURAYAMA-SHI,, TOKYO, 208-8585, JAPAN
Covered Property
(1)
Wire Bonding Apparatus and Method of Manufacturing Semiconductor Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.