Patent Assignment
Reel/Frame 040007/0920
Assignment of Assignor's Interest
Recorded: 2016-10-13
Pages: 4
Assignors
CHEN, SHING-CHAO
Executed: 2016-09-23
LIN, CHIH-WEI
Executed: 2016-09-23
CHIANG, TSUNG-HSIEN
Executed: 2016-09-23
CHENG, MING-DA
Executed: 2016-09-23
HSIEH, CHING-HUA
Executed: 2016-09-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method for Forming Chip Package Involving Cutting Process