Patent Assignment
Reel/Frame 040009/0695
Assignment of Assignor's Interest
Recorded: 2016-10-13
Pages: 3
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-12, NEUBIBERG, 85579, GERMANY
Covered Property
(1)
Substrate and Method Including Forming a via Comprising a Conductive Liner Layer and Conductive Plug Having Different Microstructures