Patent Assignment
Reel/Frame 040014/0417
Assignment of Assignor's Interest
Recorded: 2016-10-14
Pages: 3
Assignor
DENDA, TATSUAKI
Executed: 2016-06-17
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI, NAGANO, 381-2287, JAPAN
Covered Property
(1)
Wiring Substrate and Method of Manufacturing the Same