Patent Assignment
Reel/Frame 040017/0593
Assignment of Assignor's Interest
Recorded: 2016-10-14
Pages: 6
Assignors
LEE, SEOK-HYUN
Executed: 2016-06-24
CHOI, YUN-SEOK
Executed: 2016-06-24
CHO, TAE-JE
Executed: 2016-06-24
PARK, JIN-WOO
Executed: 2016-06-24
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chip Package and Method of Manufacturing the Same