Patent Assignment
Reel/Frame 040026/0212
Assignment of Assignor's Interest
Recorded: 2016-10-17
Pages: 4
Assignors
CHANG, KAI-FUNG
Executed: 2016-08-12
LEU, LEN-YI
Executed: 2016-08-12
TSAI, LIEN-YAO
Executed: 2016-08-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Package Structure and Manufacturing Method Thereof