Patent Assignment
Reel/Frame 040027/0309
Assignment of Assignor's Interest
Recorded: 2016-10-17
Pages: 6
Assignors
KO, CHA-WON
Executed: 2016-07-22
KIM, HYUN-WOO
Executed: 2016-08-08
CHO, YOUN-JOUNG
Executed: 2016-07-25
HAN, JIN-KYU
Executed: 2016-08-08
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Forming Semiconductor Device Using Metal-Containing Hardmask to Pattern Photoresist Having Protected Polyer