Patent Assignment
Reel/Frame 040063/0946
Assignment of Assignor's Interest
Recorded: 2016-10-19
Pages: 4
Assignor
SAITO, HISAYUKI
Executed: 2016-08-29
Assignee
SHIN-ETSU HANDOTAI CO., LTD
2-1, OHTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Method for Evaluating Warpage of Wafer and Method for Sorting Wafer