Patent Assignment
Reel/Frame 040067/0034
Assignment of Assignor's Interest
Recorded: 2016-10-19
Pages: 4
Assignors
HUANG, TZU-SUNG
Executed: 2016-09-01
YU, CHEN-HUA
Executed: 2016-10-03
TSAI, HAO-YI
Executed: 2016-10-06
KUO, HUNG-YI
Executed: 2016-09-06
TSENG, MING HUNG
Executed: 2016-10-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Hexagonal Semiconductor Package Structure