Hexagonal semiconductor package structure

1. A method of forming a coil structure, comprising: forming a first conductive element on a wafer, the first conductive element forming a first continuous spiral having a hexagonal shape in a plan view of the first conductive element; forming a second conductive element on the wafer, the second conductive element forming a second continuous spiral having a hexagonal shape in a plan view of the second conductive element, wherein forming the first conductive element and forming the second conductive element comprise: forming a photoresist over a first dielectric layer; patterning the photoresist to form a plurality of openings in the photoresist; performing a plating process to fill the plurality of openings with a conductive material; and removing the photoresist; encapsulating the first conductive element and the second conductive element in an encapsulating material; forming a second dielectric layer overlying the encapsulating material; forming a first plurality of electrical connectors in the second dielectric layer, the first plurality of electrical connectors being electrically connected to the first conductive element; forming a second plurality of electrical connectors in the second dielectric layer, the second plurality of electrical connectors being electrically connected to the second conductive element; and singulating the first conductive element from the second conductive element using a laser grooving process.

2. The method according to claim 1 , further comprising:

forming a third conductive element and a fourth conductive element in the encapsulating material, the third conductive element and the fourth conductive element respectively forming a continuous spiral having a hexagonal shape in a plan view of the third conductive element and the fourth conductive element.

3. The method according to claim 2 , further comprising arranging the first conductive element, the second conductive element, the third conductive element, and the fourth conductive element in a honeycomb pattern.

4. The method according to claim 1 , wherein a virtual line extends from a center point of the first continuous spiral to a center point of the second continuous spiral, and wherein the first conductive element passes over the virtual line at least three times.

5. The method according to claim 1 , further comprising electrically coupling each of the first plurality of electrical connectors and each of the second plurality of electrical connectors to a circuit for charging a battery.

6. The method according to claim 1 , further comprising electrically coupling each of the first plurality of electrical connectors and each of the second plurality of electrical connectors to an electrical circuit that comprises a power source and a microcontroller.

7. The method according to claim 1 , further comprising:

arranging the first conductive element, the second conductive element, and a plurality of additional conductive elements on a surface, wherein each of the plurality of additional conductive elements has a hexagonal shape in a plan view of the additional conductive element;

wherein the first conductive element, the second conductive element and the plurality of additional conductive elements are arranged in a honeycomb pattern; and

wherein an area of the surface in which the first conductive element, the second conductive element and the plurality of additional conductive elements are arranged comprises over 91% of a total area of the surface.

8. A method, comprising: forming a plurality of coils, each coil comprising a conductive element that forms a hexagonal shape in a plan view, wherein forming the plurality of coils comprises: forming a first dielectric layer over a carrier; forming a seed layer over the first dielectric layer; forming a photoresist over the seed layer; patterning the photoresist to form a plurality of openings in the photoresist; performing a plating process to fill the plurality of openings with a conductive material; and removing the photoresist; encapsulating each coil in an encapsulating material; arranging the plurality of coils on a wafer in a symmetric array; and performing a laser grooving process to singulate each of the plurality of coils before arranging the coils on the wafer in the symmetric array.

9. The method of claim 8 , wherein sidewalls of each coil are aligned with sidewalls of adjacent coils, and the symmetric array comprises a honeycomb pattern.

10. The method of claim 8 , further comprising forming a second dielectric layer overlying the plurality of coils.

11. The method of claim 8 , further comprising forming a plurality of electrical connectors that are configured to electrically connect each conductive element in the plurality of coils to an external electrical circuit.

12. The method of claim 11 , further comprising connecting each of the plurality of electrical connectors to the external electrical circuit, wherein the external electrical circuit is electrically connected to an antenna.

13. A method, comprising:

forming a photoresist over a first dielectric layer;

patterning the photoresist to form a plurality of openings, wherein in a plan view the openings define a plurality of continuous spirals arranged in an array;

performing a plating process to fill the plurality of openings with a conductive material, to form a plurality of conductive coils;

removing the photoresist;

encapsulating sidewalls of the plurality of conductive coils with a molding material;

forming a second dielectric layer over the plurality of conductive coils; and

performing a laser grooving process to singulate a first conductive coil of the plurality of conductive coils from a second conductive coil of the plurality of conductive coils.

14. The method according to claim 13 , further comprising:

forming a plurality of first connectors, wherein, for each of the plurality of conductive coils, a first connector of the plurality of first connectors is connected to an innermost end of the respective conductive coil.

15. The method according to claim 14 , further comprising:

forming a plurality of second connectors, wherein, for each of the plurality of conductive coils, a second connector of the plurality of second connectors is connected to an outermost end of the respective conductive coil.

16. The method according to claim 13 , wherein the array is a honeycomb pattern array.

17. The method according to claim 13 , wherein each of the plurality of conductive coils forms a hexagonal shape in a plan view.

18. The method according to claim 13 , wherein each of the plurality of conductive coils has a same shape in a plan view, and each of the plurality of conductive coils has a same size.