Patent Assignment
Reel/Frame 040068/0637
Assignment of Assignor's Interest
Recorded: 2016-10-19
Pages: 5
Assignors
HAGIWARA, YOSHIHITO
Executed: 2016-09-02
SASAKURA, KAZUMASA
Executed: 2016-09-08
SUNADA, TATSUYUKI
Executed: 2016-09-20
Assignee
SHINKAWA LTD.
51-1 INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI,, TOKYO, 208-8585, JAPAN
Covered Property
(1)
Ball Forming Device, Wire-Bonding Apparatus, and Ball Formation Method
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.