Patent Assignment
Reel/Frame 040068/0650
Assignment of Assignor's Interest
Recorded: 2016-10-19
Pages: 4
Assignee
SHINKAWA LTD.
51-1, INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI,, TOKYO, 208-8585, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device and Wire Bonding Apparatus
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.