IP Library Assignment 040071/0193
Patent Assignment
Reel/Frame 040071/0193

Assignment of Assignor's Interest

Recorded: 2016-09-19 Pages: 3
Assignors
LEE, SZE KUANG
Executed: 2015-01-15
MARTIN, PAUL SCOTT
Executed: 2015-01-15
KRAUS, ALBRECHT JOHANNES
Executed: 2015-01-15
KANG, CHUNHENG
Executed: 2015-01-15
PAN, HUI LING
Executed: 2015-01-15
YIN, LONG
Executed: 2015-01-15
Assignee
KONINKLIJKE PHILIPS N.V.
HIGH TECH CAMPUS 5, EINDHOVEN, 5656 AE, NETHERLANDS
Covered Property (1)
Bonding LED Die to Lead Frame Strips
Patent: 9,530,949 →
Application: 14/901,705 →
Publication: US 2016/0329473
Related Assignments (6)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Jul 7, 2017
From: LUMILEDS LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 043108/0001 →
Assignment of Assignor's Interest Nov 10, 2017
From: KONINKLIJKE PHILIPS N.V.
To: LUMILEDS LLC
Reel/Frame 044792/0018 →
Patent Security Agreement Dec 9, 2022
From: LUMILEDS, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 062114/0001 →
Security Interest Jan 5, 2023
From: LUMILEDS LLC; LUMILEDS HOLDING B.V.
To: SOUND POINT AGENCY LLC
Reel/Frame 062299/0338 →
Release of Security Interest Jan 29, 2025
From: SOUND POINT AGENCY LLC
To: LUMILEDS LLC; LUMILEDS HOLDING B.V.
Reel/Frame 070046/0001 →
Assignment of Assignor's Interest Jul 10, 2025
From: LUMILEDS LLC
To: LUMILEDS SINGAPORE PTE. LTD.
Reel/Frame 071888/0086 →