Patent Assignment
Reel/Frame 044792/0018
Assignment of Assignor's Interest
Recorded: 2017-11-10
Pages: 11
Assignor
KONINKLIJKE PHILIPS N.V.
Executed: 2017-06-30
Assignee
LUMILEDS LLC
370 W. TRIMBLE RD., SAN JOSE, CALIFORNIA, 95131
Covered Properties
(73)
Contact for a Semiconductor Light Emitting Device
Application:
12/491,976 →
Publication:
US 2010/0327300
Arrangement for Emitting Mixed Light
Arrangement for Emitting Mixed Light
Light Emitting Device Bonded to a Support Substrate
Application:
14/114,809 →
Publication:
US 2014/0077246
Reducing Solder Pad Topology Differences by Planarization
Led Module with Hermetic Seal of Wavelength Conversion Material
Encapsulated Led Lens with Bottom Reflectors
Light Emitting Structure and Mount
Led with High Thermal Conductivity Particles in Phosphor Conversion Layer
Light emitting device on a mount with a reflective layer
Method of Attaching a Light Emitting Device to a Support Substrate
Light Emitting Device with an Optical Element and a Reflector
Chip Scale Light Emitting Device Package with Dome
Light emitting diode laminated with a phosphor sheet and manufacturing method thereof
Bonding LED Die to Lead Frame Strips
Led with Stress-Buffer Layer Under Metallization Layer
Wavelength Converted Semiconductor Light Emitting Device
Pc Led with Optical Element and Without Substrate Carrier
Application:
14/906,256 →
Publication:
US 2016/0172554
Method of Separating Light Emitting Devices Formed on a Substrate Wafer
Frame Based Package for Flip-Chip Led
Islanded Carrier for Light Emitting Device
Light emitting device with improved extraction efficiency
P-N Separation Metal Fill for Flip Chip Leds
Led Having Vertical Contacts Redistributed for Flip Chip Mounting
Wavelength Converted Light Emitting Device
Lighting Device with Light Sources Positioned Near the Bottom Surface of a Waveguide
Separating a Wafer of Light Emitting Devices
Substrate for Led with Total-Internal Reflection Layer Surrounding Led
Method of Attaching a Light Emitting Device to a Support Substrate
P-Contact with More Uniform Injection and Lower Optical Loss
Glueless Light Emitting Device with Phosphor Converter
Reflective Solder Mask Layer for Led Phosphor Package
Flexible Substrate with Conductive Layer for Mounting Led Arrays
Thin Led Flash for Camera
Deep Molded Reflector Cup Used as Complete Led Package
Light Emitting Device with Reflective Sidewall
Hybrid Chip-on-Board Led Module with Patterned Encapsulation
Shallow Reflector Cup for Phosphor-Converted Led Filled with Encapsulant
Method of Forming a Wavelength Converted Light Emitting Device
Lighting Device Including a Thermally Conductive Body and a Semiconductor Light Emitting Device
Method of Bonding a Semiconductor Device to a Support Substrate
Wavelength Converted Light Emitting Device Including a Semiconductor Wavelength Converting Material and a Ceramic Phosphor
Led with Ceramic Green Phosphor and Protected Red Phosphor Layer
Light Emitting Diode with Light Emitting Layer Containing Nitrogen and Phosphorus
Light Emitting Structure and Mount
Control of P-Contact Resistance in a Semiconductor Light Emitting Device
A Flash Module Containing an Array of Reflector Cups for Phosphor-Converted Leds
Light Emitting Device on a Mount with a Reflective Layer
Bonding Led Die to Lead Frame Strips
Chip Scale Light Emitting Device Package with Dome
Asymmetrical Light Intensity Distribution from Luminaire
Method of Forming a Composite Substrate
Shallow Reflector Cup for Phosphor-Converted Led Filled with Encapsulant
Sapphire Collector for Reducing Mechanical Damage During Die Level Laser Lift-Off
Luminance Pattern Shaping Using a Back-Emitting Led and a Reflective Substrate
Wavelength Converted Semiconductor Light Emitting Device
Led Package with Integrated Features for Gas or Liquid Cooling
Led with Stress-Buffer Layer Under Metallization Layer
Method of Forming a Wavelength Converted Light Emitting Device
Application:
15/607,180 →
Publication:
US 2017/0331011
Frame Based Package for Flip-Chip Led
Application:
15/640,482 →
Publication:
US 2017/0301841
Light Emitting Device with Improved Extraction Efficiency
P-N Separation Metal Fill for Flip Chip Leds
Led Having Vertical Contacts Redistributed for Flip Chip Mounting
Application:
15/664,651 →
Publication:
US 2018/0019370
Separating a Wafer of Light Emitting Devices
Integration Methods for High Ri Lumiramic Attach Glue
Application:
62/172,834 →
Reflective coating for Flip-Chip Chip-Scale Package LEDs improved package efficiency
Application:
62/238,664 →
Flip-Chip SMT LEDs with Variable Number of Emitting Surfaces
Application:
62/238,666 →
Wavelength converted light emitting device with textured substrate
Application:
62/243,470 →
Die Bond Pad Design to Enable Different Electrical Configurations
Application:
62/258,385 →
Led Metal Pad Configuration for Optimized Thermal Resistance, Solder Reliability, and Smt Processing Yields
Application:
62/262,311 →
Flip Chip Led with Side Reflectors and Phosphor
Application:
62/272,416 →
Vapor-Phase Curing Catalysis and Passivation of Siloxane Resins in Led Applications
Application:
62/293,741 →
Device including a light guide and one or more light emitting diodes
Application:
62/298,355 →
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 30, 2013
From: BHAT, JEROME CHANDRA; AKRAM, SALMAN; STEIGERWALD, DANIEL ALEXANDER
To: KONINKLIJKE PHILIPS N.V.
Reel/Frame 031510/0364 →
Assignment of Assignor's Interest
Jul 22, 2015
From: SHIMIZU, KENTARO; BUTTERWORTH, MARK MELVIN; MORAN, BRENDAN JUDE; SHCHEKIN, OLEG BORISOVICH
To: KONINKLIJKE PHILIPS N.V.
Reel/Frame 036152/0962 →
Assignment of Assignor's Interest
Jul 28, 2015
From: DAESCHNER, WALTER; DIANA, FREDERIC STEPHANE; MALA, MOHIUDDIN; HAQUE, ASHIM SHATIL
To: KONINKLIJKE PHILIPS N.V.
Reel/Frame 036191/0904 →
Assignment of Assignor's Interest
Jul 29, 2015
From: CHOY, KWONG-HIN HENRY
To: KONINKLIJKE PHILIPS N.V.
Reel/Frame 036203/0824 →
Change of Name
Jul 31, 2015
From: PHILIPS LUMILEDS LIGHTING COMPANY LLC
To: LUMILEDS LLC
Reel/Frame 036243/0630 →
Change of Name
Jul 31, 2015
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: KONINKLIJKE PHILIPS N.V.
Reel/Frame 036243/0624 →
Assignment of Assignor's Interest
Sep 14, 2015
From: LAWRENCE, NATHANIEL T.; SHCHEKIN, OLEG; VAMPOLA, KENNETH
To: KONINKLIJKE PHILIPS N.V.
Reel/Frame 036557/0267 →
Assignment of Assignor's Interest
Oct 6, 2015
From: BASIN, GRIGORIY; FOUKSMAN, MIKHAIL
To: KONINKLIJKE PHILIPS N.V.
Reel/Frame 036740/0883 →
Assignment of Assignor's Interest
Dec 22, 2015
From: BHAT, JEROME CHANDRA; BASIN, GRIGORIY; VAMPOLA, KENNETH
To: KONINKLIJKE PHILIPS N.V.
Reel/Frame 037355/0824 →
Assignment of Assignor's Interest
Feb 17, 2016
From: MAHOWALD, PETER
To: KONINKLIJKE PHILIPS N.V.
Reel/Frame 037757/0516 →
Assignment of Assignor's Interest
Mar 22, 2016
From: AKRAM, SALMAN; ZHOU, QUANBO
To: KONINKLIJKE PHILIPS N.V.
Reel/Frame 038073/0449 →
Assignment of Assignor's Interest
Mar 23, 2016
From: LEI, JIPU; SCHIAFFINO, STEFANO; NICKEL, ALEXANDER H.; NG, MOOI GUAN
To: KONINKLIJKE PHILIPS N.V.
Reel/Frame 038086/0107 →
Assignment of Assignor's Interest
Mar 24, 2016
From: AKRAM, SALMAN; BHARDWAJ, JYOTI KIRON
To: KONINKLIJKE PHILIPS N.V.
Reel/Frame 038092/0180 →
Assignment of Assignor's Interest
May 25, 2016
From: SCHRICKER, APRIL DAWN; SHCHEKIN, OLEG BORISOVICH; CHOI, HAN HO; SCHMIDT, PETER JOSEF
To: KONINKLIJKE PHILIPS N.V.
Reel/Frame 038720/0501 →
Assignment of Assignor's Interest
Sep 19, 2016
From: LEE, SZE KUANG; MARTIN, PAUL SCOTT; KRAUS, ALBRECHT JOHANNES; KANG, CHUNHENG
To: KONINKLIJKE PHILIPS N.V.
Reel/Frame 040071/0193 →
Assignment of Assignor's Interest
Oct 27, 2016
From: BASIN, GRIGORIY; HAQUE, ASHIM SHATIL; KAGEYAMA, HIDEO; MORAN, BRENDAN JUDE
To: KONINKLIJKE PHILIPS N.V.
Reel/Frame 040155/0530 →
Security Interest
Jul 7, 2017
From: LUMILEDS LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 043108/0001 →
Assignment of Assignor's Interest
Jul 20, 2017
From: BECHTEL, HANS-HELMET; SCHMIDT, PETER J.; WENDT, MATTHIAS
To: KONINKLIJKE PHILIPS ELECTRONICS N.V.
Reel/Frame 043278/0940 →
Change of Name
Aug 14, 2017
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: KONINKLIJKE PHILIPS N.V.
Reel/Frame 043543/0903 →
Corrective Assignment to Correct the Receiving Party Name Previously Recorded at Reel: 031510 Frame: 0364. Assignor(S) Hereby Confirms the Assignment .
Oct 17, 2017
From: BHAT, JEROME CHANDRA; AKRAM, SALMAN; STEIGERWALD, DANIEL ALEXANDER
To: KONINKLIJKE PHILIPS ELECTRONICS N.V.
Reel/Frame 044218/0818 →
Assignment of Assignor's Interest
Nov 6, 2017
From: STEIGERWALD, DANIEL ALEXANDER; BHAT, JEROME CHANDRA; AKRAM, SALMAN
To: KONINKLIJKE PHILIPS ELECTRONICS N.V.
Reel/Frame 044035/0968 →
Change of Name
Nov 8, 2017
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: KONINKLIJKE PHILIPS N.V.
Reel/Frame 044723/0025 →
Patent Security Agreement
Dec 9, 2022
From: LUMILEDS, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 062114/0001 →
Security Interest
Jan 5, 2023
From: LUMILEDS LLC; LUMILEDS HOLDING B.V.
To: SOUND POINT AGENCY LLC
Reel/Frame 062299/0338 →
Release of Security Interest
Jan 29, 2025
From: SOUND POINT AGENCY LLC
To: LUMILEDS LLC; LUMILEDS HOLDING B.V.
Reel/Frame 070046/0001 →