IP Library Granted Patent US 9,711,687
Granted Patent B2
US 9,711,687 · App. 14/948,042 · Granted Jul 18, 2017

Light emitting device with improved extraction efficiency

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Quick Facts
Patent No.
US 9,711,687
App. No.
14/948,042
Granted
Jul 18, 2017
Kind
B2
Abstract

In embodiments of the invention, a semiconductor structure comprising a III-nitride light emitting layer disposed between an n-type region and a p-type region is grown on a substrate. The substrate is a non-III-nitride material. The substrate has an in-plane lattice constant a substrate . At least one III-nitride layer in the semiconductor structure has a bulk lattice constant a layer and [(|a substrate −a layer |)/a substrate ]*100% is no more than 1%. A surface of the substrate opposite the surface on which the semiconductor structure is grown is textured.

Claims (37)

1. A device comprising:

a substrate; and

a semiconductor structure grown on the substrate, the semiconductor structure comprising a III-nitride light emitting layer disposed between an n-type region and a p-type region;

wherein:

the substrate is a non-III-nitride material;

the substrate has an in-plane lattice constant a substrate ;

at least one III-nitride layer in the semiconductor structure has a bulk lattice constant a layer ;

[(|a substrate −a layer |)/a substrate ]*100% is no more than 1%; and

a surface of the substrate on which the semiconductor structure is grown is angled relative to a major crystallographic plane of the substrate.

2. The device of claim 1 wherein the surface of the substrate on which the semiconductor substrate is grown is oriented between −10 and +10 degrees away from a basal (0001) plane.

3. The device of claim 1 wherein the surface of the substrate on which the semiconductor substrate is grown is angled such that large atomic terraces form on surface of the substrate on which the semiconductor substrate is grown.

4. The device of claim 1 wherein a surface of the substrate opposite a surface on which the semiconductor structure is grown is textured.

5. The device of claim 1 wherein the substrate is ScMgAlO 4 .

6. The device of claim 1 wherein the substrate is RAO 3 (MO) n , where R is selected from Sc, In, Y, and the lanthanides; A is selected from Fe (III), Ga, and Al; M is selected from Mg, Mn, Fe (II), Co, Cu, Zn and Cd; and n is an integer ≧1.

7. The device of claim 1 wherein the substrate has an index of refraction of at least 2.0.

8. The device of claim 1 wherein the surface of the substrate on which the semiconductor structure is grown is textured.

9. The device of claim 1 further comprising a lattice of holes or posts formed on the surface of the substrate on which the semiconductor structure is grown.

10. The device of claim 1 wherein the substrate is shaped into a truncated inverted pyramid.

11. The device of claim 1 further comprising a photonic crystal formed in one of a surface of the substrate on which the semiconductor structure is grown and a semiconductor layer in the semiconductor structure.

12. The device of claim 1 wherein the surface of the substrate opposite the surface on which the semiconductor structure is grown is textured with hexagonal pyramids.

13. The device of claim 1 wherein the semiconductor structure is attached to a mount and the substrate is less than 50 μm thick.

14. A device comprising:

a substrate;

a semiconductor structure grown on the substrate, the semiconductor structure comprising a III-nitride light emitting layer disposed between an n-type region and a p-type region; and

a pattern disposed within the n-type region, the pattern comprising:

a first n-type layer with a pattern formed on a top surface of the first n-type layer; and

a second n-type layer disposed over the top surface of the first n-type layer, wherein the first and second n-type layers have different indices of refraction;

wherein:

the substrate is a non-III-nitride material;

the substrate has an in-plane lattice constant a substrate ;

at least one III-nitride layer in the semiconductor structure has a bulk lattice constant a layer ; and

[(|a substrate −a layer |)/a substrate ]* 100% is no more than 1%.

15. The device of claim 14 wherein the second n-type layer fills in regions between features that form the pattern.

16. The device of claim 14 wherein the pattern comprises at least one region of lower elevation.

17. The device of claim 16 wherein the at least one region of lower elevation is one of a hole and a region between two posts.

18. The device of claim 14 wherein the pattern comprises holes arranged in a lattice to form a photonic crystal.

19. The device of claim 14 wherein the pattern comprises posts arranged in a lattice to form a photonic crystal.

Assignments (7)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 10, 2025
From: LUMILEDS LLC
To: LUMILEDS SINGAPORE PTE. LTD.
Reel/Frame 071888/0086 →
RELEASE OF SECURITY INTEREST Recorded Jan 29, 2025
From: SOUND POINT AGENCY LLC
To: LUMILEDS LLC; LUMILEDS HOLDING B.V.
Reel/Frame 070046/0001 →
SECURITY INTEREST Recorded Jan 5, 2023
From: LUMILEDS LLC; LUMILEDS HOLDING B.V.
To: SOUND POINT AGENCY LLC
Reel/Frame 062299/0338 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 10, 2017
From: KONINKLIJKE PHILIPS N.V.
To: LUMILEDS LLC
Reel/Frame 044792/0018 →
CHANGE OF NAME Recorded Aug 14, 2017
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: KONINKLIJKE PHILIPS N.V.
Reel/Frame 043543/0903 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 21, 2017
From: GARDNER, NATHAN FREDRICK; EPLER, JOHN EDWARD; MCLAURIN, MELVIN BARKER; CAMRAS, MICHAEL DAVID; DAVID, AURELIEN JEAN FRANCOIS; GOETZ, WERNER KARL; GRUNDMANN, MICHAEL JASON
To: KONINKLIJKE PHILIPS ELECTRONICS N.V.
Reel/Frame 043064/0478 →
SECURITY INTEREST Recorded Jul 7, 2017
From: LUMILEDS LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 043108/0001 →