Light emitting device with an optical element and a reflector
View Patent ↗A structure according to embodiments of the invention includes a semiconductor light emitting device and an optical element disposed over the semiconductor light emitting device. The semiconductor light emitting device is disposed in a recess in the optical element. A reflector is disposed on a bottom surface of the optical element. A method according to embodiments of the invention includes disposing a semiconductor light emitting device on a substrate and forming a reflector adjacent the semiconductor light emitting device. An optical element is formed over the semiconductor light emitting device. The semiconductor light emitting device is removed from the substrate.
1. A method comprising:
disposing a reflective foil on a substrate, the reflective foil having an opening;
disposing a semiconductor light emitting device on the substrate, the semiconductor light emitting device being disposed in the opening of the reflective foil;
forming an optical element over the semiconductor light emitting device such that the reflective foil is in contact with a full length of a base of the optical element; and
removing the semiconductor light emitting device from the substrate.
2. The method of claim 1 wherein forming an optical element over the semiconductor device comprises molding a lens over the semiconductor light emitting device after disposing the semiconductor light emitting device in the opening.
3. The method of claim 1 wherein the semiconductor light emitting device is disposed in a recess in the optical element.
4. The method of claim 1 further comprising laminating a wavelength converting layer over the semiconductor light emitting device.
5. The method of claim 4 wherein the wavelength converting layer covers a top surface and at least one side surface of the semiconductor light emitting device.
6. The method of claim 1 wherein disposing a reflective foil on a substrate comprises roll-laminating a metal foil on the substrate.
7. The method of claim 6 further comprising forming the opening before said roll-laminating.
8. The method of claim 1 further comprising forming the opening before said disposing a reflective foil on a substrate.
9. The method of claim 1 further comprising forming the opening after said disposing a reflective foil on a substrate.
10. The method of claim 1 wherein the reflective foil is between 0.1 and 30 microns thick.
11. The method of claim 1 further comprising forming the opening by punching the reflective foil.
12. The method of claim 1 further comprising forming the opening by cutting the reflective foil.